Thermal Management of High Heat Flux Electronics

BRYAN BURK, JENSEN HOKE, JOSH RICHEY, CALEB ANDERSON

PAST: TORBEN GRUMSTRUP, TAYLOR BEVIS

Temperature [C] distribution in a silicon block

As electronics trend towards increased miniaturization and greater performance, the need for high-performance cooling of becomes critical.  Waste heat generated by microprocessors, laser diodes, and other electronics must be removed from the device to enable optimal functionality and avoid catastrophic overheating.  As devices get smaller and performance demands increase, the resulting heat fluxes become extremely high.  Sophisticated heat-removal technologies must be employed to manage such fluxes by dissipating heat to the ambient at a rapid rate.  Torben’s research focuses on research and development of such high-performance cooling techniques.  He uses finite element analysis (FEA) software to create models of devices and the associated cooling structures.  The models are a powerful tools for optimization of cooling techniques because they permit one to examine performance for a large assortment of configurations and parameters without manufacturing and testing physical devices.  Moreover, results from experiments conducted by other lab members can be incorporated into the model to improve the realism and applicability of the results.  The models provide valuable capability in ITS Lab’s effort to develop new and ever-higher performance cooling technologies.  With electronics becoming smaller and ever more powerful, Torben’s research is working to meet the need for correspondingly improved cooling technologies.